FINAL PROGRAM

THIRD INTERNATIONAL SYMPOSIUM ON ADHESIVE

JOINTS: FORMATION,CHARACTERISTICS AND TESTING

Providence Biltmore Hotel, Providence, Rhode Island (USA);

June 26-28, 2002

This symposium continues the series of meetings on this topic the first of which was held as a part of the American Chemical Society meeting in Kansas City, 1982. There are a myriad of applications (ranging from aerospace to surgery) where adhesives are used to join different materials, and concomitantly the understanding of the behavior of adhesive joints becomes very important. There are many factors which can influence the behavior of adhesive joints, e.g., interfacial aspects, joint design, mode of stress, etc., and in order to understand the joint behavior in a holistic manner, one must take due

cognizance of all these relevant factors. In conformity with the title of the Symposium, it is planned to address not only how to make acceptable joints but their characterization, durability, and testing are accorded due consideration. The purpose of this Symposium is to provide a forum for discussing the latest developments, identifying areas which need intensified R&D activity, and cross-pollination of ideas. The technical program l comprises both invited and contributed papers, which are of both overview and original research in nature.

SESSION I: THURSDAY, JUNE 27, 2002

8:30-8:35: INTRODUCTORY REMARKS

8:35-9:05: Michel Klein; Ecole Nationale Supérieure de Techniques Avancées, Unité d' Enseignement et de Recherche de Mécanique, Groupe Matériaux-Structures, 32, Bd Victor, 75739 Paris Cedex 15, FRANCE; Local Modeling of Transverse Normal Stress in a Double-lap Joint

9:05-9:35: M. J. Cowling; Glasgow Marine Technology Centre, University of Glasgow, Glasgow, G12 8QQ, U.K.; Structural Integrity of Adhesively-bonded Joints in GRE Pipework Systems

9:35-10:05: Thorsten Neeb, W. Brockmann, S. Emrich, M. Graf, K. Grüner and J. Nass;

Universität Kaiserslautern, Arbeitsgruppe Werkstoff- und Oberflächentechnik (AWOK), Erwin-Schrödinger-Str. 56/344, D - 67663 Kaiserslautern, GERMANY; Durability of Bonded Joints and Reliable Assessment by Appropriate Short-time Testing Methods

10:05-10:30: COFFEE BREAK

10:30-11:00: D. Tzetzis; Queen Mary, University of London, Materials Department, London E1 4NS, UK; Double Cantilever Beam Mode I Testing for Vacuum Infused Repairs of CFRP

11:00-11:30: Raymond A. Pearson; Materials Research Center, Microelectronics Packaging Materials Lab., Lehigh University, Bethlehem, PA 18015-3195; Using the Asymmetric Double Cantilever Beam Test for Evaluating Polymer-Polymer and Polymer-Metal Interfaces

11:30-12:00: Min YOU^{1, 2}, Xiao-Ling ZHENG², Yong ZHENG², Wei-Hao XIONG¹; 1) State Key Laboratory of Mould Technology, Huazhong Univ. of Sci. and Technol., Wuhan 430074, CHINA;

2) College of Mech. and Mater. Eng., China Three Gorges Univ., Yichang 443002, CHINA; Analysis on the Model of Stress and Hardness Distribution of Joint Made of Steel Adherends under Cleavage Strength Testing

12:00-1:30: LUNCH

1:30-2:00: T. Sawa¹, I. Huguchi² and H. Suga¹; 1) Department of Mechanical Engineering, Yamanashi University, (4-3-11,Takeda, Kofu, Yamanashi, 400-0016 Japan); 2) Josai High School (Kofu, Yamanashi, 400 JAPAN); Three-dimensional Finite Element Stress Response Analysis of Single-lap Adhesive Joints of Dissimilar Adherends Subjected to Impact Tensile Loads

2:00-2:30: John N. Rossettos; Department of Mechanical, Industrial & Manufacturing Engineering Northeastern University, Boston, MA 02115-5000; Thermal Peel, Warpage and Interfacial Shear Stresses in Adhesive Joints

2:30-3:00: D. Ratna, B.C.Chakraborty and P.C. Deb; Naval Materials Research Laboratory, Shil-Badlapur Road, Anand Nagar P.O. , District Thane Maharashtra - 421 506, INDIA; A Novel Adhesive based on Flexibilized Epoxy Resin

3:00-3:30: COFFEE BREAK

3:30-4:00: Jangsoon Kim and Earle Ryba; Department of Materials Science and Engineering, The Pennsylvania State University, University Park, PA 16802; Grazing Incidence X-ray Diffraction Studies of Adhesion of Polyurethane Thin Films to an Al Substrate

4:00-4:30: Min You¹^{, 2}, Wei-Hao Xiong¹, Xiao-Ling Zheng², Yong Zheng²; 1) State Key Laboratory of Mould Technology, Huazhong Univ. of Sci. and Technol., Wuhan 430074,CHINA

2) College of Mech. and Mater. Eng., China Three Gorges Univ., Yichang 443002, CHINA; Analysis on the Strength Testing Methods of Adhesively Bonded Joints

4:30-5:00: Yu-kun Yang , Feng Wang and Huo Li; Institute of Chemistry, Chinese Academy of Sciences, Beijing 100080, P. R. CHINA; Studies on the Migration of Surfactants in Acrylic Emulsion Pressure Sensitive Adhesives by XPS Analysis

SESSION III: FRIDAY, JUNE 28, 2002

8:30-9:00: Jin Kook Kim and Dai Gil Lee; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, ME3261, 373-1, Guseong-dong, Yuseong-gu, Daejeon, 305-701, Republic of KOREA; Investigation of Optimal Surface Treatments for Carbon/Epoxy Composite Adhesive Joints

9:00-9:30: Dai Gil Lee, Chang Sup Lee, Tae Seong Lim and Jae Wook Kwon; Department of Mechanical Engineering, ME3261, Korea Advanced Institute of Science and Technology, Guseong-dong, Yuseong-gu, Daejeon, 305-701, REPUBLIC OF KOREA; Dependency of Peel Strength of Foam Core Sandwich Beams on the Resin Impregnated Interfacial Surface

9:30-10:00: Jae Wook Kwon and Dai Gil Lee; Korea Advanced Institute of Science and Technology, Department of Mechanical Engineering, ME3221, 373-1, Gusong-dong, Yusong-gu, Daejon 305-701, KOREA; In Situ Cure Monitoring for Adhesively Bonded Joints by Dielectometry

10:00-10:30: COFFEE BREAK

10:30- 11:00: N. Guo, J. Abdul, H. Du, and B.S. Wong; School of Mechanical & Production Engineering, Nanyang Technological University, Singapore 639798; Nondestructive Evaluation of the Interface between a Die Attach Adhesive and a Copper Leadframe in IC Packaging

11:00-11:30: T. Sawa¹; Department of Mechanical Engineering, Yamanashi University, (4-3-11,Takeda, Kofu, Yamanashi, 400-0016 Japan) 2 Josai High School (Kofu, Yamanashi, 400 JAPAN); Adhesive Joints Under Static and Impact Loads

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