FINAL PROGRAM

SECOND INTERNATIONAL SYMPOSIUM ON ADHESION MEASUREMENT OF THIN FILMS AND COATINGS

OCTOBER 25-27, 1999

ROBERT TREAT HOTEL

NEWARK, NJ

This symposium is the natural follow on to the first international conference on this topic held in 1992 in Boston. This, the second symposium, follows up on the latest developments in this tremendously active field. The primary focus of this meeting is to provide a forum for the discussion of cutting edge advancements in the field and to review and consolidate the accomplishments which have been achieved thus far.

October 25, 1999

8:30-8:35: Opening Remarks

8:35-9:15: Methods for Measuring the Adhesion of Films on Ductile Substrates; Anthony Evans; Princeton Materials Institute, Bowen Hall, Princeton, NJ 08540

9:15-9:55: A Comparative Study of Adhesion Test Methods for Hard Coatings Including Aspects of Non-destructive Testing; H. Ollendorf 1, T. Schuelke 2 and D. Schneider3; 1) White Oak Semiconductor, 6000 Technology Blvd, Sandston, VA 23150; 2) Fraunhofer USA, Bradley University, 1501 W. Bradley Avenue, Peoria, IL 61625; 3) Fraunhofer Institute for Materials and Beam Technology, Winterbergstr. 16, D-01277 Dresden, GERMANY

9:55-10:30: COFFEE BREAK

10:30-11:00: Relative Adhesion Measurement for Microelectronic Structures; L.P.Buchwalter; IBM T.J. Watson Research Center; Yorktown Heights, NY 10598

11:00-11:30: Energetic Approach for the Evaluation of Adhesion of Sputter Deposited TiC Films Measured by Scratch Test; A. Kinbara, A. Sato, E. Kusano and N. Kikuchi; AMS R&D Center, Kanazawa Inst. Technol., Matto, Ishikawa 924-0838, JAPAN

11:30-12:00: Scratch Adhesion Testing of Thin Hard Tribological Coatings - Challenges and New Opportunities; H. Ronkainen, VTT Manufacturing Technology, P.O. Box 1702, FIN-02044 VTT, FINLAND

12:00-1:30: LUNCH

1:30-2:00: Can the Scratch Adhesion Test Ever be Quantitative?; S. J. Bull; Department of Mechanical, Materials and Manufacturing Engineering, University of Newcastle, Newcastle-upon Tyne, NE1 7RU, UK

2:00-3:30: Scratch Test Failure Modes and Performance of Organic Coatings for Marine Applications; S.J. Bull, K. Horvathova, D. Mitchell and J. R. White; Department of Mechanical, Materials and Manufacturing Engineering, University of Newcastle, Newcastle-upon Tyne, NE1 7RU, UK

2:30-3:00: Repeatability in the Micro-scratch Measurement for the Adhesion of Thin Films and the Physical Meaning.; Shigeru Baba; Applied Physics, Seikei University, Kichijoji-Kita, Musashino, Tokyo 180-8633 JAPAN

3:00-3:30: COFFEE BREAK

3:30-4:00: Characterization of Thin Film Adhesion with the Nano-Scratch Tester (NST); N. X. Randall, CSEM Instruments S. A.; Jaquet-Droz 1, CH-2007 Neuchâtel, SWITZERLAND

4:00-430: On the Evaluation of Substrate-Coating Adhesion by Indentation Experiments; B. Rother, MAT GmbH Dresden, Reisstr. 3, D-01257 Dresden, GERMANY

OCTOBER 26, 1999



8:30-9:00: Studies of Adhesion of Thermal Spray Materials: Measurement Techniques and Mechanistic Studies; Christopher C. Berndt; Department of Materials Science and Engineering, SUNY at Stony Brook, Stony Brook, NY 11794-2275

9:00-9:30: Residual Stress Evolution During the Tensile Failure of Submicron Multilayers; Michael Ignat; Inst. Natl. Polytechnique Grenoble, BP 75, Domaine Universitaire, F-38402 St. Martin d'Heres, FRANCE

9:30-10:00: Progress in Measuring Residual Stresses in Coatings Through Bilayer Curvature; Jang-Horng Yu, D. A. Dillard, T. G. Park and C. Smith; Engineering Science and Mechanics Department, Virginia Tech, Blacksburg, VA 24061

10:00-10:30: COFFEE BREAK

10:30-11:00: Raman Spectroscopy of Residual Stresses in Diamond Films; Qi Hua Fan*1, J. Grácio2 and E. Pereira1; 1) Department of Physics, University of Aveiro, 3810 Aveiro, PORTUGAL; 2) Department of Mechanical Engineering, University of Aveiro, 3810 Aveiro, PORTUGAL

11:00-11:30: Influence of the Interface Layers and Microstresses in the Coatings on the Adhesion of Ion-plated Tin Coatings; Zhiming Yu, Li Yu and Henyi Jin; State Key Laboratory for Corrosion and Protection, Institute of Corrosion, and Protection of Metals CAS, Wencui Road 62, 110015 Shenyang, CHINA

11:30-1:00: LUNCH

1:00-1:30: Measurement of Adhesion of Hard Coatings on Ductile Substrates; Michael D. Drory; Timken-Aerospace-MPB, P.O. Box 547, Keene, NH 03431

1:30-2:00: Adhesion Testing of Nanophase Diamond Coatings on Steel and Carbide Substrates; F. Davanloo, H. Park and C.B. Collins; Center for Quantum Electronics, University of Texas at Dallas,P.O. Box 830688, Richardson, TX 75083-0688; K.J. Koivusaari, Microelectronics and Material Physics Laboratories and EMPART Research Group of Infotech Oulu, Department of Electrical Engineering, University of Oulu, PL 444, FIN-90571 Oulu, FINLAND

2:00-2:30: Improvement and Test of Diamond Film Adhesion on Steel Substrate by Cu/TiC Sputtering Layer; X.C.He, H.S.Shen,Z.M.Zhang and Y.Z.Wan; State Key Lab of MMCM's, Shanghai Jiao Tong University, Shanghai 200030, CHINA

2:30-3:00: Measurement of Interfacial Fracture Energy in Microelectronic Multifilm Applications; Jack C. Hay, Eric Liniger and Xiao Liu; IBM Research, P.O. Box 218, Yorktown Heights, NY 10598-0218

3:00-3:30: COFFEE BREAK

3:30-4:00: Quantification of Coating Adhesion Using Laser Induced Decohesion Spectroscopy; J. S. Meth; DuPont Co., Central Science & Engineering, Wilmington, DE 19880-0328

4:00-4:25: A Pulsed Laser Technique to Evaluate the Adhesion Strength of Oxide Films on Metallic Substrates; R. Oltra, V. Vignal and G. Rosa; Laboratoire de Recherches sur la Reactivite des Solides (UMR CNRS 5613), Universite de Bourgogne, BP 47870, 21078 Dijon Cedex, FRANCE

4:25-4:50: Blade Adhesion Test Applied to Polyimide Films on Silicon; Salim Khasawinah and Charles Schmidt; Hewlett Packard Company , Ink Jet Business Unit, Corvallis, OR 97330

October 27, 1999

8:30-9:00: Elastic-plastic Peeling of Thin Films; Q. D. Yang and M. D. Thouless; Dept. of Mechanical Engineering and Applied Mechanics, University of Michigan, Ann Arbor, MI 48105

9:00-9:30: Mode II Edge Delamination of Compressed Thin Films; Daniel Balint and John Hutchinson; Division of Engineering and Applied Sciences, Harvard University, 327 Pierce Hall, 29 Oxford Street, Cambridge, MA 02138

9:30-10:00: Adhesion and Abrasion of Sputter-deposited Ceramic Thin Films on Glass; Susumu Suzuki*, Research Center, Asahi Glass Co., Ltd.,

1150 Hazawa-cho, Kanagawa-ku, Yokohama 221-0863, JAPAN

10:00-10:30: COFFEE BREAK

10:30-11:00: The JKR Technique of Measuring Adhesion; Herbert Hui, J. Baney and Y.Y. Lin; 313-4, Kimball Hall, TAM, Cornell University, Ithaca , NY 14853

11:00-11:30: Adhesion Measurement and Toughening Mechanisms at Underfill Interfaces for Flip-Chip-On-Organic-Substrate Packaging; Xiang "Sam" Dai, Mark V. Brillhart1, Michael Roesch, and Paul S. Ho2; Hewlett-Packard Co., 1501 Page Mill Rd., MS 5L-C, Palo Alto, CA 94304; 1) Cisco Systems, Inc., 170 West Tasman Drive, San Jose, CA 95134-1706; 2) University of Texas, Materials Lab for Interconnect & Packaging, PRC/MER, MC R8650, Austin, TX 78712

11:30-12:00: Low Cycle Friction Fatigue Testing under Subcritical Loads for Selective

Interface Delamination; J. von Stebut; Laboratoire de Science et Genie des Surfaces, Ecole des Mines, Parc de Saurupt, F-54042 Nancy,

FRANCE

12:00-12:30: Multimode Scratch Testing - An Entirely Innovative European Measurement and Testing Programme in Considerable Progress with Respect to Existing Instruments; J. von Stebut; Laboratoire de Science et Genie des Surfaces, Ecole des Mines, Parc de Saurupt, F-54042 Nancy, FRANCE

12:30: CONCLUDING REMARKS