FINAL PROGRAM



INTERFACES IN POLYMER

COMPOSITES AND

HIGH TECH ADHESIVES

COMBINED PROGRAM

Hilton Savannah DeSoto Hotel

Savannah, GA; December 7-8, 2004

SESSION I: TUESDAY, DECEMBER 7, 2004

8:30 - 8:35: INTRODUCTION

8:35-9:05: Michael S. Silverstein; Department of Materials Engineering, Technion - Israel Institute of Technology, Haifa 32000, ISRAEL; Plasma Fluoropolymer Surfaces and Interfaces

9:05-9:35: Jae Youn Lee, Sandeep Tyagi, Gavin Buxton and Anna C. Balazs; Chemical and Petroleum Engineering Department, University of Pittsburgh, Pittsburgh,k PA 15261; Using Theory and Simulation to Design Self-Healing Nanocomposite Thin Films

9:35-10:05: S. Suryanarayan and T. S. Creasy; Polymer Technology Center, Department of Mechanical Engineering, Texas A&M University, M.S. 3123, 100 Engineering Physics Building, College Station, TX 77843-3123; Implications of a Granular Interface in Carbon Nanotube Reinforced Polymers

10:05-10:20: COFFEE BREAK

10:20-10:50: Kaichang Li, Yu Geng and John Simonsen; Department of Wood Science and Engineering, Oregon State University, Corvallis, OR 97331; A New Method to Improve the Interfacial Adhesion Between Wood and Polyethylene in Wood-Polyethylene Composites

10:50-11:20: M. Rafailovich, M. Si and Y-S Seo; SUNY Stony Brook Stony Brook, NY;S. Satija, NIST, Gaithersburg, MD; M. Bronner, Yale University, New Haven, CT; M. Snow, Cornell University, Ithaca NY; B. Cohen, HAFTR HS, Cedarhurst, NY; and J. Nissel, DRS HS, Woodmere, NY; The Effects on Nanoparticles on Interfacial Fracture Toughness and Dynamics

11:20-11:50: Ivan Chodák; Polymer Institute, Centre of Excellence CEDEBIPO, Slovak Academy of Sciences, Dúbravská cesta 9, 842 36 Bratislava, SLOVAKIA; Tailoring the Interface in Thermoplastics / Organic Filler Composites via Crosslinking

11:50-12:20: John Simonsen; Department of Wood Science and Engineering, Oregon State University, 120 Richardson Hall, Corvallis, OR; Interphase Characterization in Filled Thermoplastics

12:20-1:30: LUNCH BREAK

SESSION II: TUESDAY, DECEMBER 7, 2004

1:30-2:00: Nikhil E. Verghese1, D. Haeberle2, .J Lesko3 and J. Riffle3; 1) Core R&D - Materials Research, The Dow Chemical Company, 2301 N. Brazosport Blvd., B-1603, Freeport, TX 77541-3257; 2) Exxon Mobil, Houston, Texas; 3) Departments of Engineering Science and Mechanics and Chemistry respectively, Virginia Tech, Blacksburg, VA; Thermoset Polymer Matrix Composite Interface Design, Mechanics and Durability

2:00-2:30: Toshiyuki Sawa1 and Kohei Ichikawa2; 1) Hiroshima University, 1-4-1 Kagamiyama, Higashi-hiroshima, Hiroshima 739-8527, JAPAN; 2) University of Yamanashi, 4-3-11 Kakeda, Kofu, Yamanashi 400-8511, JAPAN; Stress Analysis and Strength Estimation of Butt Adhesive Joints with Fillers under Static Tensile Loadings

2:30-3:00: Rajesh R. Gomatam1 and Erol Sancaktar2; 1) Materials and Manufacturing Laboratory, Department of Mechanical Engineering, and Mechanics, Lehigh University, Bethlehem, PA 18015; 2) Department of Polymer Engineering, The University of Akron, Akron, OH 44325-0301; A Comprehensive Fatigue Life Predictive Model for Joints Bonded Using a Silver-Filled Electronically Conductive Adhesive

3:00-3:30: Makoto Imanaka1, Satoshi Motohashi1, Yoshinobu Nakamura2 and Masaki Kimoto3; 1) Division of Mechanical Engineering, Osaka University of Education, Asahigaoka, Kashiwara city, Osaka 582-8582, JAPAN; 2) Department of Applied Chemistry, Osaka Institute of Technology, Ohmiya, Asahi-ku, Osaka 535-8585, JAPAN; 3) Division of Material Technology, Technical Research Institute of Osaka Prefecture, Aayumino Izumi City, Osaka 594-11577, JAPAN; R-curve Behavior of CTBN and Cross-linked Rubber Particles Modified Epoxy Adhesives under Mode I Loading

3:30-3:45: COFFEE BREAK

3:45-4:15: Zhixin Kang a, Kunio Mori b, Hidetoshi Hirahara b and Yuanyuan Li a; a) Key Laboratory for Advanced Metallic Materials Research and Processing Technology of Guangdong Province, South China University of Technology, Guangzhou 510640, P.R. CHINA; b) Department of Chemical Engineering, Iwate University, Morioka 020-8551, JAPAN; Polymer Plating of Triazine Dithiols on Magnesium Alloy and Their Direct Adhesion to Plastic

4:15-4:45: Burhanettin Uysal, and Ayhan Özçfç; Zonguldak Karaelmas University, Safranbolu College, Technical Programs, 78 600 Karabük, TURKEY; Effects of Aging and Environment on Bonding Strength of Polyurethane Based Desmodur-VTKA Adhesive in Some Wood Materials

4:45-5:15: Veena Choudhary; CPSE, Indian Institute of Technology, Haus Khas, New Delhi - 110 016, INDIA; Soyprotein Adhesives: Effect of Additives on the Properties

5:15-5:45: Ayhan Özçfc1 and Burhanettin Uysal2; 1) Technical Education Faculty of Zonguldak Karaelmas University, Karabük, TURKEY; 2) Technical Programs, Safranbolu College, Zonguldak Karaelmas University, TURKEY; Improvement of Laminated Wood Material Properties by Impregnation with Some Chemicals

SESSION III: WEDNESDAY, DECEMBER 8, 2004

8:30-9:00: Paul Ludwig Geiss and Daniel Vogt; Kaiserslautern University of Technology, Faculty Mechanical and Process Engineering, Workgroup Materials and Surface Technologies, DE-67663 Kaiserslautern, GERMANY; Assessment and Prediction of Mechanical Long-term Properties of Adhesive With High Plasticity

9:00-9:30: Toshiyuki SAWA1 and Kohei Ichikawa2; 1) Hiroshima University, 1-4-1 Kagamiyama, Higashi-hiroshima, Hiroshima 739-8527, JAPAN; 2) University of Yamanashi, 4-3-11 Kakeda, Kofu, Yamanashi 400-8511, JAPAN; An FEM Stress Analysis and Strength Estimation of Stepped-lap Adhesive Joints under Static Bending Moments

9:30-10:00: Felix Kleiner; Henkel Technologies, R&D Engineering Adhesives, Global Engineering Center, Gutenbergstrasse 3, D-85748 Garching-Hochbrueck, GERMANY; Identification and Determination of Adequate Material Parameters Essential for the Numerical Simulation of High-Tech Adhesive Joints

10:00-10:15: COFFEE BREAK

10:15-10:45: T. Patz1, R. Narayan1, R. Cristescu2, I.N. Mihailescu2 , N. Menegazzo3, B. Mizaikoff3, J.J. Wilker4, I. Stamatin5 and D.B. Chrisey6; 1) School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Dr NW, Atlanta, GA 30332-0245; 2) National Institute for Lasers, Plasma and Radiation Physics, P.O. Box MG-36, RO-077125, Bucharest-Magurele, ROMANIA; 3) School of Chemistry and Biochemistry, Georgia Institute of Technology, Atlanta, GA 30332-0400; 4) Department of Chemistry, Purdue University, 560 Oval Drive, West Lafayette, IN 47907-2084; 5) University of Bucharest, Faculty of Physics, P.O. Box MG-11, 3NanoÇôSAE, Bucharest-Magurele, ROMANIA; 6) US Naval Research Laboratory, Washington, D.C. 20375-5345; Matrix Assisted Pulsed Laser Evaporation of Mussel Adhesive Protein Thin Films

10:45-11:15: Yuji Sato and Masataka Murahara; Department of Electrical and Electronic Engineering, Tokai University, 1117 Kitakaname Hiratsuka, Kanagawa 259-1292, JAPAN; Comparison of Hydrophilic and Oleophilic Groups Substitution on PTFE Surface with V-UV Photon Irradiation for Protein Adsorption

11:15-11:45: Masataka Murahara and Takayuki Funatsu; Department of Electrical and Electronics Engineering, Tokai University, 1117 Kitakaname, Hiratsuka-shi, Kanagawa 259-1292, JAPAN; Photochemical Adhesion of Fused Silica Glasses with Silicone Oil

11:45-1:15: LUNCH BREAK

SESSION IV: WEDNESDAY, DECEMBER 8, 2004

1:15-1:45: Xiuzhi Susan Sun, Department of Grain Science and Industry, Kansas State University, 201 Shellenberger Hall, Manhattan, KS 66506; Plant Protein Adhesives and Performance

1:45-2:15: Rajesh R. Gomatam1 and Erol Sancaktar2; 1) Materials and Manufacturing Laboratory, Department of Mechanical Engineering, and Mechanics, Lehigh University, Bethlehem, PA 18015; 2) Department of Polymer Engineering, The University of Akron, Akron, OH 44325-0301; A Novel Cumulative Fatigue Damage Model for Assessing Residual Fatigue Life Under Variable Loading for Joints Bonded Using a Silver-Filled Electronically Conductive Adhesive

2:14-2:45: Erol Sancaktar, Pankaj Rajput and Amit Khanolkar, Department of Polymer Engineering, The University of Akron, Akron, OH 44325-0301; Correlation of Pullout Strength of Silver Wire Embedded in an Adhesive Matrix to Surface Mass Loss by Silver Migration

2:45-3:00: COFFEE BREAK

3:00-3:30: Michael Witt , Forest Research, Rotorua, New Zealand; New Rheometer Measurement Geometry and the Characterisation of Solvent Absorption Effects in the Cure Behavior of Adhesives in Wood Joints

3:30-4:00: Masashi Inagaki, Yuji Sato and Masataka Murahara; Department of Electrical Engineering, Tokai University, 1117 Kitakaname, Hiratsuka, Kanagawa 259-1292, JAPAN; Development of PET Ligament with High Adhesive Strength with Biological Tissues by Using ArF Excimer Laser

4:00-4:30: Hiroyuki Anai, Yuji Sato and Masataka Murahara; Department of Electrical and Electronic Engineering, Tokai University, 1117 Kitakaname Hiratsuka, Kanagawa 259-1292, JAPAN; Development of Water Permeable & Bio-compatible Membrane and Albumin Adsorption Effect