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 C A L L F O R P A P E R S
INTERNATIONAL SYMPOSIUM ON HIGH-TECH ADHESIVES AND ADHESIVE
JOINTS: TESTING, CHARACTERIZATION AND APPLICATIONS
Hilton Savannah DeSoto, Savannah, GA, December 8-10, 2004 |
| This symposium integrates two topics which heretofore
were covered in separate meetings. However, since
adhesives and adhesive joints are strongly related topics
it is clearly apropos to consider the two together. In
addition to covering all of the traditional topics dealing
with adhesives and adhesive joints, this symposium will
further emphasize leading edge applications such as
underfill adhesives for joining silicon chips to epoxy
boards, conductive adhesives, aircraft adhesives and joint
technology and biological adhesives. In particular,
adhesive joints for biomedical applications are one of the
most demanding uses of adhesive technology and also
one of the most promising for treating bone fractures and
other wounds. |
In order to understand the joint behavior in a holistic
manner, this symposium will give special emphasis to the
problem of adhesive formulation as it affects adhesive
joint design as well as other factors such as interfacial
phenomena, mode of loading and effects of environment.
Thus, in conformity with the title of the symposium, it is
planned to address how adhesive formulation and
adhesive joint technology combine to make high
performance joints. Finally, the overall emphasis of this
symposium will be to provide a forum for discussion of
various ramifications of the myriad adhesive/ adhesive
joint technologies now available. Particular focus will be
on the dissemination of the latest information available
and the cross-pollination of ideas. |
TOPICS OF INTEREST INCLUDE:
- Chemistry, synthesis and characterization of adhesive
formulations
- All aspects of adhesive joint testing
PHYSICO-CHEMICAL PROPERTIES
- Thermal-mechanical properties
- Rheological properties
- Adhesion properties and adhesion improvement
- Effects of aging and environment on long term stability,
reliability and durability
CHARACTERIZATION AND TESTING
- Fracture mechanics of joint testing
- Fracture toughness of adhesives
- Novel and advanced joint testing methods
APPLICATIONS
- Pressure sensitive adhesives
- Biomedical adhesives
- Adhesives for composites/building materials, aerospace,
automotive, marine,... etc.
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This symposium is being organized under the direction of
Dr. K. L. Mittal, Editor, Journal of Adhesion Science and
Technology by MST Conferences, LLC. A proceedings
volume is planned for this symposium and further details
will be provided in due course. Please notify the
conference chairman of your intentions to present a paper
as early as possible. An abstract of about 200 words
should be sent by July 30, 2004 to the conference
chairman by any of the following methods:
E-mail: rhl@mstconf.com
FAX: 212-656-1016
Regular mail:
Dr. Robert H. Lacombe
Conference Chairman
3 Hammer Drive
Hopewell Junction, NY 12533
Contact by phone: 845-226-1393; 845-227-7026
Full conference details and registration via the Internet
will be maintained on our web site:
http://mstconf.com/HTadhesives.htm
Or mail response form below to conference chairman at
address above |