FINAL PROGRAM



NINTH INTERNATIONAL SYMPOSIUM ON PARTICLES

ON SURFACES: DETECTION, ADHESION AND REMOVAL

Sheraton Society Hill Hotel,

Philadelphia, PA (USA); June 17-18, 2004

This will be the ninth event in the series of symposia on particles on surfaces initiated as part of the Fine Particle Society meeting in 1986. Particles are yield detractors in the manufacture of sophisticated and sensitive electronic components and are very undesirable in many other technologies. Contamination of optical surfaces and shorting of microelectronic circuits by conducting particles, among other concerns, underscore the importance of particle detection, adhesion and removal. On the other hand, however, in certain instances particle adhesion to surfaces is necessary. The purpose of this symposium is to address the vast ramifications of particles on solid surfaces by bringing together specialists in many allied fields to discuss their latest findings and to identify areas for further investigation. Various types of substrates and particles including metals, oxides, glass, and polymers are covered. Please note that the address given may apply only to the presenting author



SESSION I: THURSDAY, JUNE 17, 2004



8:00-8:05: INTRODUCTORY REMARKS



8:05-8:35: Rajiv Kohli; Washington Group International, NASA Johnson Space Center,P.O. Box 58128, Houston, TX 77258; Recent Developments in Imaging and Analysis of Micro and Nanosize Particles

8:35-9:05: Robert Kaiser; Josh Grilly and Adam Kulczyk; Entropic Systems, Inc., 34c Holton Street, Woburn, MA 01801; Photodigital Imaging as a Means of Monitoring Particulate Contamination on Surfaces

9:05-9:35: Christopher C. Walton; Lawrence Livermore National Lab., 7000 East Avenue, Mail Stop L-395, Livermore, CA 94550;Modeling Particle Defect Transport During Sputter Deposition

9:35-10:05: Mahmoud Melehy; University of Connecticut, Dept. of Electrical & Computer Engineering, 260 Glenbrook Road, Storrs, CT 06269-2157; Adhesion of Particles on Surfaces: A New Thermodynamic Consequence



10:05-10:20: COFFEE BREAK



10:20-10:50: Michael Kappl; Lars Heim, Stefan Ecke, Mahdi Farshchi and Hans-Jürgen Butt; Max Planck Institute for Polymer Research, Mainz, GERMANY; Adhesion and Friction of Single Micron-sized Particles

10:50-11:20: Thomas Bahners, Torsten Textor, Win Labuda and Eckhard Schollmeyer; Deutsches Textilforschungszentrum Nord-West e.V., Adlerstr. 1, D-47798 Krefeld, GERMANY; The Effect of Laser-induced Microroughness of Textile Fibers on Adhesion and Capture of Micrometer-sized Particles

11:20-11:50: Wim Fyen, Frank Holsteyns, Twan Bearda, Sophia Arnauts and Paul W. Mertens; IMEC, Kapeldreef 75, B-3001 Heverlee, BELGIUM; Drying Techniques in the Semiconductor Industry

11:50-12:20: Ian Watson; Department of Mechanical Engineering, Room 336 James Watt (South) Bldg., University of Glasgow, Glasgow G12 8QQ, UK; Laser Inactivation and Detection of Bacteria



12:20-1:20: LUNCH



SESSION II, THURSDAY, JUNE, 17, 2004



1:20-2:00: John Durkee; 437 Mack Hollimon, Kerrville, TX 78028; An Independent Evaluation of Cleaning with CO2 -- Where is the Value?

2:00-2:30: Souvik Banerjee and Andrea Campbell; BOC Eco-Snow Systems, 4935A Southfront Road, Livermore, CA 94551; Principles and Mechanisms of Sub-Micron Particle Removal By CO2 Cryogenic Technology

2:30-3:00: Wayne T. McDermott , Gene Parris, Dean V. Roth and Christopher J. Mammarella; Air Products and Chemicals, Inc., 7201 Hamilton Boulevard, Allentown, PA 18195; Particle Removal in Dense Phase Fluids Using Entrainers and Ultrasonic



3:00-315: COFFEE BREAK



3:15-3:45: Michael L. Free, D. Y. Ryu, R. Bhide, and A. Wessman; Department of Metallurgical Engineering, University of Utah, Salt Lake City, UT 84112; Using Surfactant Adsorption Information to Predict Particle Removal

3:45-4:15: Sami B. Awad; Crest Ultrasonics, Scotch Rd,Trenton, NJ 08682; Ultrasonics and Particle Extraction

4:15-4:45: Steven Verhaverbeke and Roman Gouk; Applied Materials, 974 E. Arques Ave, MS81307, Sunnyvale, CA 94085; Single Wafer Megasonics Configurations: Parallel and Perpendicular to the Wafer Surface

4:45-5:15: G. Vereecke, F. Holsteyns, S. Arnauts, K. Kenis, M. Lux, R. Vos, J. Snow, and P.W. Mertens; IMEC, Kapeldreef, 75, B-3001 Heverlee, BELGIUM; Removal of Nano-Particles and Structural Damage in Megasonic Cleaning of Silicon Wafers

5:15-5:45: Roger W.Welker; R.W. Welker Associates, 19060 Brasilia Dr., Northridge, CA 91326; Clean Then Assemble Versus Assemble Then Clean: Several Comparisons





SESSION III: FRIDAY, JUNE 18, 2004



8:00-8:30: Torsten Textor, Thomas Bahners, Win Labuda and Eckhard Schollmeyer; Deutsches Textilforschungszentrum Nord-West e.V., Adlerstr. 1, D-47798 Krefeld, GERMANY; Evaluating Wiping Materials used in Cleanrooms and Other Controlled Environments

8:30-9:00: Robert Kaiser, Justin Desrosiers and Adam Kulczyk; Entropic Systems, Inc., 34c Holton Street, Woburn, MA 01801; Decontamination of Surrogate Pu 238 Legacy Wastes

9:00-9:30: J. C. J. van der Donck, R. Schmits, R.E. van Vliet and A.G.T.M. Bastein, TNO TPD, P.O. box 155, 2600 JA Delft, THE NETHERLANDS; Removal of Sub-100 nm Particles from Structured Substrates

9:30-10:00: Charlotte Frederick and Don Gray; HyperFlo, 240 North Sunway Drive, Gilbert, AZ 85284; Sub- Sub Micron Cleaning Using Vacuum Cavitational Streaming (VCS)



10:00-10:15: COFFEE BREAK



10:15-10:45: Kuniaki Gotoh; Dept. Applied Chemistry, Okayama University, Tsushima-naka 3-1-1, Okayama 700-8530, JAPAN; Removal of Micron-order Particles by Impinging Air Jet

10:45-11:15: Daniel A. Koos, Daniel J. Vitkavage, David A. Hansen, and Karen A. Reinhardt; Novellus Systems, Inc., 300 N 56th Street, Chandler, AZ 85226; Development of a Non-Contact Post-CMP Cleaning Process for Copper

11:15-11:45: Ismail Kashkoush, Thomas Nolan, Dennis Nemeth and Richard Novak; Akrion LLC, 6330 Hedgewood Drive, Suite 150, Allentown, PA 18106; Advanced Front End of the Line Clean for Post CMP Processes

11:45-12:15: Michael T. Andreas; Micron Technology, Inc., m/s 01-719, 8000 S. Federal Way, PO Box 6, Boise ID 83707-0006; Particle Removal Challenges and Solutions in Semiconductor Fabrication CMP Processes



12:15-1:15: LUNCH



SESSION IV: FRIDAY, JUNE 18, 2004



1:15-1:45: Y. F. Lu,L. P. Li, K. K. Mendu, J. Shi, D. W. Doerr and D. R. Alexander; Department of Electrical Engineering, The University of Nebraska-Lincoln, Lincoln, NE 68588-0511; Laser-Assisted Nanofabrication Using Micro and Nanoparticles

1:45-2:15: George Dubé and J. Daniel Kelley; MetaStable Instruments, Inc., 5988 Mid Rivers Mall Drive - Suite 236, St. Charles, MO 63304; Particle Removal by Attenuated Total Internal Reflection of Laser Light

2:15-2:45: Wolfgang Kautek; Laboratory for Thin Film Technology, Federal Institute for Materials Research and Testing, Unter den Eichen 87, D-12205 Berlin, GERMANY; Laser Cleaning of Fibrous Substrates



2:45-3:00: COFFEE BREAK



3:00-3:30: Dongsik Kim; Department of Mechanical Engineering, POSTECH, Pohang 790-784, KOREA; Removal of Particles Using the Combined Effect of Laser-induced Shock Wave and Explosive Vaporization of Liquid

3:30-4:00: Shishir Shukla; Arkansas State University, AR 72467; Primary and Secondary Effect of Laser Cleaning for Nano-Sized Particulate Contamination

4:00-4:30: Alex Biris and M. K. Mazumdar; Department of Applied Science, Univ. of Arkansas at Little Rock, 2801 S. University Avenue, Little Rock, AR 77204; Electrodynamic Removal of Particles

4:30-5:00: Lewis Liu, Ismail Kashkoush, Alan Walter and Rich Novak; AKrion LLC, 6330 Hedgewood Drive, #150, Allentown, PA 18106; Development of Using Ozonated DI Water for Pre-gate Cleaning


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