Grosvenor Resort Hotel, Orlando, FL

November 13-15, 2002

This is the second symposium in this series the first of which was held in the Fall of 2000 in Newark, NJ. Polymeric materials have been an integral part of the electronics industry since its inception. The earliest applications were for wire insulation and protective coatings. With the coming of the revolution fostered by integrated circuits the applications of polymers in electronics exploded into a variety of areas including: photoresists, dielectric layers, encapsulants, circuit boards, multichip modules, underfill materials, thermal compounds and passivation layers. One of the primary goals of this symposium is to provide a forum for a discussion of the myriad applications of polymers in microelectronics which have arisen in the last 20 years. Particular focus is on the dissemination of the latest information available and the cross-pollination of ideas. The technical program contains both invited overviews and contributed original research papers .

The invited speakers have been selected so as to represent widely differing disciplines and interests, and they hail from academic, governmental and industrial research laboratories.

SESSION I: Wednesday November 13, 2002

8:30-8:35: Opening Remarks

8:35-9:15: Donald J Hayes, David B. Wallace and Michael Grove; MicroFab Technologies, Inc., 1104 Summit Avenue, Suite 110, Plano, TX 75074; Ink Jet Printing of Polymers for Electronic and Photonics Applications

9:15-9:45: John Rogers; Bell Laboratories, Lucent Technologies, 600 Mountain Avenue, Room 1D332, Murray Hill, NJ 07974; Materials and Patterning Techniques for Flexible and Nanoscale Electronics

9:45-10:15: Lim Yoke Keem, Ng Chee Mang and R. N. Kumar; School of Industrial Technology, Unbiversiti Sains Malaysia, 11800 Pulau Pinang, Malaysia; Ultraviolet Radiation Curing Technology for Encapsulation of Led Lamps by Epoxy Resins

10:15-10:45: COFFEE BREAK

10:45-11:15: Sudipta Seal; Advances Materials Processing and Analysis Center (AMPAC), Mechanical Materials and Aerospace Engineering, University of Central Florida, Orlando, FL 32816; Characterization of Polyeurathane Pads for Chemical Mechanical Planariztion Used in Microelectronics Industry Using XPS, SIMS, and AFM and Polishing Performance

11:15-11:45: Heinz Dieter Carstanjen; MPI fur Metallforschung, Heisenbergst.1,D-70569 Stuttgart, GERMANY; Use of High-resolution Ion Beam Techniques in the Analysis of Polymers In Microelectronic Devices

11:45-12:15: N. Haddaoui, A. Merzouki; Laboratoire PCHP, Département de Génie Chimique, Faculté des Sciences de l'ingénieur, Univ. F. ABBAS de Sétif 19000, Sétif ALGERIE; Development and Characterization of Polymers and Blend Composites Susceptible to act as a Current Collector

12:15-2:00: LUNCH

SESSION II: Wednesday November 13, 2002

2:00-2:30: R. N. Kumar ,Lim Yoke Keem and Ng Chee Mang; School of Industrial Technology, Unbiversiti Sains Malaysia, 11800 Pulau Pinang, MALAYSIA; Development of Ultraviolet Curable Encapsulating Epoxy Resin Formulations for the Production of Led's

2:30-3:00: S. D. Rostami and Anne Gonthier; TWI Ltd. Granta Park, Cambridge CB1 6AL, ENGLAND; Adhesion of PI Coated Optical Fibre to PZT Substrates

3:00-3:30: A. Thran, V. Zaporojtchenko and F. Faupel; Lehrstuhl fuer Materialverbunde, Technische Fakultaet der Universitaet Kiel, Kaiserstr. 2, 24143 Kiel, GERMANY; Evidence of Noble Metal Diffusion in Polymers at Room Temperature

3:00-3:30: COFFEE BREAK

4:00-4:30: Dan Xu 1, W.H. Yu1, K.G. Neoh1 and E.T. Kang1, Yan Zhang2, A.A.O. Tay2, S.S. Ang2 ; 1) Department of Chemical Engineering, National University of Singapore, 10 Kent Ridge Crescent, SINGAPORE 119260; 2) Department of Mechanical Engineering, National University of Singapore, Engineering Drive 2, SINGAPORE 119260; Electroless Metallization of Modified Silicon Surfaces

4:30-5:00: S. Zheng1, A. Entenberg2, G. A. Takacs1 , F. D. Egitto3, and L. J. Matienzo3; 1) Department of Chemistry and Center for Materials Science and Engineering, Rochester Institute of Technology, Rochester, New York, 14623; 2) Department of Physics, RIT, Rochester, New York, 14623; 3) IBM Corporation, Microelectronics Division, Endicott, New York 13760; Adhesion of Copper to Poly(tetrafluoroethylene) Surfaces Modified with Vacuum UV Radiation

5:00-5:30: Xue, Qi; Department of Polymer Science & Engineering, Nanjing University, Nanjing, 210093, P. R. CHINA; Conductive Rubber for Electronic Applications

Seon Jeong Kim, Sang Jun Park, In Young Kim and Sun I. Kim; Dept. of Biomedical Engineering, Hanyang University, Sungdong P.O. Box 55, Seoul 133-605, KOREA; Characteristics of Electric Stimuli Response of Poly(vinyl alcohol)/

Chitosan IPN Hydrogel in NaCl Solutions POSTER

SESSION III: Thursday November 14, 2002

8:30-9:10: C. Grant Willson; Department of Chemical Engineering, University of Texas at Austin, Austin, TX 78712; Polymers for 157 nm Resist Applications

9:10-9:40: W. Volksen, R.D. Miller, J.L. Hedrick, C. Hawker, H.C. Kim, T. Magbitang, V. Lee, M. Toney, P. Rice, K. Rodbell1, S. Cohen1, E. Liniger1, J. Hay1, E. Huang1, K. Lynn2, , M. Weber2 and M. Petkov2; IBM Almaden Research Center, 650 Harry Road, San Jose, CA 95120; 1) IMB T.J. Watson Research Center, Kitchawan Road, Yorktown, NY 10598

2) Washington State University, Pullman, WA 99164; Nanoporous, Low Dielectric Constant Organosilicate Materials Based on Inorganic/Organic Polymer Blends

9:40-10:10: K. Malone1, C. Tyberg2, S. Nitta2, S. Narayan2, J.C. Hedrick2,

S.T. Chen1, R. Dellaguardia1, B. Herbst2, and K. Kumar1; 1) Semiconductor Research and Development Center; IBM Microelectronics, 2070 Route 52, Hopewell Junction, NY 12533; 2) IBM T.J. Watson Research Center, Yorktown Heights, NY 10598; Developmental Integration of Porous SiLKTM

10:10-10:40: COFFEE BREAK

10:40-11:10: N.E. Iwamoto; Honeywell Electronic Materials, P.O. Box 547, Ramona, CA 92065; Molecular Modeling of Low k Dielectric Materials

11:10-11:40: Ana Martin1, Jorg Schuhmacher1, Quoc Toan Le1, Caroline Whelan1, Marc Schaekers, Jean-Pierre Celis2 and Karen Maex1 ; 1) IMEC, Kapeldreef 75,B-3001 Leuven, BELGIUM; 2) K.U.Leuven, MTM, Kasteelpark Arenberg 44, B-3001 Leuven, BELGIUM; Characterisation of Ald Diffusion Barrier Growth on a Low-k Dielectric Polymer Surface

11:40-12:10: Ferdinando F. Bruno1, Lynne Samuelson1, Ramaswamy Nagarajan2,and Jayant Kumar2; 1) Natick Soldier Center, U.S. Army Soldier Biological and Chemical Command, Natick, MA 01760; 2) Center for Advanced Materials, University of Massachusetts Lowell, Lowell MA 01854