CALL FOR PAPERS

SECOND INTERNATIONAL SYMPOSIUM ON

POLYIMIDES AND OTHER HIGH

TEMPERATURE POLYMERS

SYNTHESIS, CHARACTERIZATION AND APPLICATIONS

To be held December 3-5, 2001 at the Robert Treat Hotel; Newark, NJ

This symposium is the second in a series the first which was held in Newark in 1999. As with its predecessor, this symposium will be concerned with all aspects of polyimides and other high temperature polymers. These materials have found applications in such diverse areas as the aerospace industry and microelectronic components. A unique combination of physical and chemical properties make these materials highly attractive for demanding applications where chemical inertness, high temperature stability, low dielectric constant, mechanical toughness and processability are primary concerns. This symposium is organized to bring together scientists, technologists and engineers interested in all aspects of high temperature polymers, to review and assess the current state of knowledge, to provide a forum for exchange and cross-fertilization of ideas and to define problem areas which need intensified efforts.

The invited speakers have been selected so as to represent widely differing disciplines and interests, and they hail from academic, governmental and industrial research laboratories. This meeting is planned to be a truly international event both in geographic coverage as well as in spirit. The technical program will contain both invited overviews and contributed original research papers. It is planned to chronicle the transactions in a hard-bound volume of archival quality (to match or exceed the standards of the journal literature) which will serve as a reference work for future generations of investigators.

TOPICS OF INTEREST INCLUDE:

Chemistry, synthesis and characterization of polyimides and other high temperature polymers.
Surface chemistry and surface modification

PHYSICO-CHEMICAL PROPERTIES

Thermal-mechanical properties
Electrical properties
Adhesion properties and adhesion improvement
Encapsulation and barrier properties
Effects of aging and environment on long term stability, reliability and durability

APPLICATIONS

Polyimides as adhesives and insulators. Metallization of polyimide coatings.
Polyimides as dielectrics, photoresists and encapsulants in microelectronic structures

NOVEL AND ADVANCED FORMULATIONS

Ultralow dielectric materials, low thermal expansion liquid crystals, polyimide blends, copolymers, foams,... etc.

This symposium is being organized by MST Conferences, LLC under the direction of Dr. K. L. Mittal, Editor, Journal of Adhesion Science and Technology. A proceedings volume is planned for this symposium and further details will be provided in due course. Please notify the conference chairman of your intentions to present a paper as early as possible. An abstract of about 200 words should be sent by June 15, 2001 to the conference chairman by any of the following methods:

E-mail: rhl@mstconf.com

FAX: 212-656-1016

Regular mail:

Dr. Robert H. Lacombe

Conference Chairman

3 Hammer Drive

Hopewell Junction, NY 12533

CLICK HERE TO SUBMIT AN ABSTRACT OR GET ON CONFERENCE MAILING LIST: ONLINE RESPONSE FORM

MST Conferences Webmaster
Your comments and inquiries are most welcome
Address all correspondence to:
rhlacombe@compuserve.com