CALL FOR PAPERS

SECOND INTERNATIONAL SYMPOSIUM ON ADHESION MEASUREMENT OF THIN FILMS AND COATINGS

OCTOBER 25-27, 1999

NEWARK AIRPORT

NEWARK, NJ

Thin films and coatings are one of the most pervasive and widespread technologies of the modern world. Applications range from the preservation of metal finishes in industries such as automobiles and watercraft to forming critical dielectric layers in microelectronic structures which are the foundation of the computer and consumer electronics industries. In all of these applications the adhesion of the coating to its substrate is critical to the coating's performance, reliability and durability. Thus the ability to accurately measure the adhesion of coatings to surfaces is a crucial part of the development and manufacturing process of coatings and films. In addition, the ability to make accurate adhesion measurements requires a fundamental understanding of the physics, chemistry and mechanics of thin films and coatings. This symposium is the natural follow on to the first international conference on this topic held in 1992 in Boston. This, the second symposium, will follow up on the latest developments in this tremendously active field. The primary focus of this meeting will be to provide a forum for the discussion of cutting edge advancements in the field and to review and consolidate the accomplishments which have been achieved thus far.

TOPICS OF INTEREST INCLUDE:

Adhesion measurements in quality control and manufacturing

Adhesion measurements in support of coating process research and development

Adhesion measurement instrumentation for laboratory and manufacturing environments

FUNDAMENTAL ASPECTS OF ADHESION MEASUREMENT

Mechanics of adhesion testing, the role of film stresses

Fracture mechanics of adhesion testing

Physico-chemical aspects of adhesion testing, the role of film morphology and chemistry

ADVANCED TEST AND DATA ANALYSIS METHODS

Qualitative, semiquantitative and fully quantitative analysis methods.

Novel test methods: laser spallation, internal friction, electromagnetic,... etc.

Thermodynamic aspects of adhesion testing, (energy flow and balance, calorimetry, ... etc)

This symposium is being organized under the direction of Dr. K. L. Mittal, Editor, Journal of Adhesion Science and Technology by MST Conferences, LLC. A proceedings volume is planned for this symposium and further details will be provided in due course. Please notify the conference chairman of your intentions to present a paper as early as possible. An abstract of about 200 words should be sent by September 15, 1999 to the conference chairman by any of the following methods:

E-mail: rhl@mstconf.com

FAX: 212-656-1016

Regular mail:

Dr. Robert H. Lacombe.

Conference Chairman.

3 Hammer Drive

Hopewell Junction, NY 12533

Contact by phone: 914-227-7026

Full conference details and registration via the Internet will be maintained on our web site:

http://mstconf.com/adhmeas.htm

CLICK HERE TO SUBMIT AN ABSTRACT OR GET ON CONFERENCE MAILING LIST: ONLINE RESPONSE FORM

MST Conferences Webmaster
Your comments and inquiries are most welcome
Address all correspondence to:
rhlacombe@compuserve.com