CALL FOR PAPERS

SEVENTH INTERNATIONAL SYMPOSIUM ON METALLIZED PLASTICS: FUNDAMENTAL AND APPLIED ASPECTS

DECEMBER 2-3, 1999

NEWARK AIRPORT

NEWARK, NJ

This symposium is the seventh in a continuing series designed to bring together an international group of experts to discuss the latest developments in the field of metallized plastics. Metallized plastics have become a burgeoning technology with applications ranging from decorative design to optical coatings to advanced thin film wiring schemes in the microelectronics industry. Metallized plastic films and coatings allow the technologist to capitalize on the favorable properties of two disparate classes of materials to create new and unique products which transcend the performance and usefulness which can be obtained in either class alone. Metals offer high electrical conductivity, excellent reflectivity and superior barrier properties. Plastics compliment this menu with their excellent insulating properties, optical clarity, mechanical flexibility and ease of molding and processing. Papers are solicited on all aspects of plastics metallization including unique metallization methods, novel material combinations and specialized coating characterization and analysis methods. This symposium will follow up on the latest developments in this tremendously active field and provide a forum for the discussion of cutting edge advancements and review and consolidate the accomplishments which have been achieved thus far.

TOPICS OF INTEREST INCLUDE:

Metallization techniques and properties of metal deposits

Metal diffusion during deposition

Morphology and properties of metal deposits

INVESTIGATION OF INTERFACIAL INTERACTIONS

Influence of polymer surface functional groups

Metal-polymer interactions

Fundamental adhesion mechanisms including coating-substrate interactions

PLASTIC SURFACE MODIFICATION

Dry (vacuum) surface treatment of plastics

Wet chemical surface treatment of plastics

Mechanical surface treatment and cleaning

BASIC PHYSICAL PROPERTIES AND ADHESION

Effects of aging and environment on adhesion

Mechanical properties and failure mechanisms

Diffusion, permeation and barrier properties

This symposium is being organized under the direction of Dr. K. L. Mittal, Editor, Journal of Adhesion Science and Technology by MST Conferences, LLC. A proceedings volume is planned for this symposium and further details will be provided in due course. Please notify the conference chairman of your intentions to present a paper as early as possible. An abstract of about 200 words should be sent by September 15, 1999 to the conference chairman by any of the following methods:

E-mail: rhl@mstconf.com

FAX: 212-656-1016

Regular mail:

Dr. Robert H. Lacombe.

Conference Chairman.

3 Hammer Drive

Hopewell Junction, NY 12533

Contact by phone: 914-227-7026

Full conference details and registration via the Internet will be maintained on our web site:

http://mstconf.com/metalpla.htm

Or mail response form below to conference chairman at address above.

CLICK HERE TO SUBMIT AN ABSTRACT OR GET ON CONFERENCE MAILING LIST: ONLINE RESPONSE FORM

MST Conferences Webmaster
Your comments and inquiries are most welcome
Address all correspondence to:
rhlacombe@compuserve.com