CALL FOR PAPERS

SECOND INTERNATIONAL SYMPOSIUM ON PLASMA POLYMERIZATION/DEPOSITION: FUNDAMENTAL AND APPLIED ASPECTS

MAY 27-28, 1999

SHERATON NEWARK AIRPORT

NEWARK, NJ

The topic of plasma polymerization/deposition has been of great interest for quite some time and currently there is a strong research and development effort being carried out worldwide on this topic. Plasma deposited coatings find a wide range of varied applications in many industries. Thin film deposition in the microelectronics industry being just one example. Furthermore, plasma deposited coatings can achieve a variety of useful properties unobtainable by other coating techniques. The primary purpose of this symposium will be to cover both the fundamental and applied aspects of plasma coating deposition technology including all varieties of materials both organic and inorganic. This symposium is the natural follow on to the first international conference on this topic held in 1993 in Las Vegas. This the second symposium will follow up on the latest developments in this tremendously active field. The primary focus of this meeting will be to provide a forum for the discussion of cutting edge advancements in the field and to review and consolidate the accomplishments which have been achieved thus far.

PAPERS DEALING WITH ALL ASPECTS OF PLASMA POLYMER DEPOSITION WILL BE CONSIDERED INCLUDING: Plasma sources and reactor systems Factors affecting plasma polymerization/deposition and plasma enhanced deposition Properties of plasma deposited coatings Characterization of plasma deposited coatings Monitoring plasma deposition processes APPLICATIONS Ultrahard coatings: diamond, boron nitride, silicon nitride, diamond-like-carbon,...etc. Biological applications: medical implants and prosthetics Microelectronic applications: photoresists, barrier layers and encapsulants, insulators,...etc. Specialty coatings, composites, adhesion promoters

This symposium is being organized under the direction of Dr. K. L. Mittal, Editor, Journal of Adhesion Science and Technology, in cooperation with the C4 Technologies Company. A proceedings volume is planned for this symposium and further details will be provided in due course. Please notify the conference chairman of your intentions to present a paper as early as possible. An abstract of about 200 words should be sent by February 10, 1999 to the conference chairman by any of the following methods: E-mail: rhlacombe@compuserve.com FAX: 212-656-1016 Regular mail: Dr. Robert H. Lacombe, Conf. Chair. C4 Technologies, Inc. 3 Hammer Drive Hopewell Junction, NY 12533 Contact by phone: 914-227-7026 Full conference details and registration via the Internet will be maintained on our web site: http://ourworld.compuserve.com/ homepages/rhlacombe/conf.htm Or mail response form below to conference chairman at address above.