CALL FOR PAPERS

INTERNATIONAL SYMPOSIUM ON POLYIMIDES AND OTHER HIGH TEMPERATURE POLYMERS: SYNTHESIS, CHARACTERIZATION AND APPLICATIONS

NOVEMBER 29 - DEC. 1, 1999

NEWARK AIRPORT

NEWARK, NJ

Since the earliest pioneering work there has been an accelerated interest in the use of polyimides and other high temperature polymers for a wide variety of applications. These materials have found applications in such diverse areas as the aerospace industry and microelectronic components. A unique combination of physical and chemical properties make these materials highly attractive for demanding applications where chemical inertness, high temperature stability, low dielectric constant, mechanical toughness and processability are primary concerns. The technical program will contain both invited and contributed papers which will reflect both original research and overviews. The central focus of this symposium will be to provide a forum for the discussion of cutting edge advancements in the field and to review and consolidate the accomplishments which have been achieved thus far.

TOPICS OF INTEREST INCLUDE: Chemistry, synthesis and characterization of polyimides and other high temperature polymers. Surface chemistry and surface modification PHYSICO-CHEMICAL PROPERTIES Thermal-mechanical properties Electrical properties Adhesion properties and adhesion improvement Encapsulation and barrier properties Effects of aging and environment on long term stability, reliability and durability APPLICATIONS Polyimides as adhesives and insulators. Metallization of polyimide coatings. Polyimides as dielectrics, photoresists and encapsulants in microelectronic structures NOVEL AND ADVANCED FORMULATIONS Ultralow dielectric fluorinated materials, low thermal expansion liquid crystal morphologies, polyimide blends, copolymers, foams,... etc.

This symposium is being organized under the direction of Dr. K. L. Mittal, Editor, Journal of Adhesion Science and Technology by MST Conferences, LLC. A proceedings volume is planned for this symposium and further details will be provided in due course. Please notify the conference chairman of your intentions to present a paper as early as possible. An abstract of about 200 words should be sent by September 15, 1999 to the conference chairman by any of the following methods: E-mail: rhl@mstconf.com FAX: 212-656-1016 Regular mail: Dr. Robert H. Lacombe. Conference Chairman. 3 Hammer Drive Hopewell Junction, NY 12533 Contact by phone: 914-227-7026 Full conference details and registration via the Internet will be maintained on our web site: http://mstconf.com/polyimd.htm Or mail response form below to conference chairman at address above.

Copyright © 1999, MST Conferences, LLC
Revised -- 7/1/99
URL: http://mstconf.com/polyimd.htm