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 C A L L F O R P A P E R S
SECOND INTERNATIONAL SYMPOSIUM ON
POLYMERS IN MICROELECTRONICS
Grosvenor Resort Hotel, Orlando, FL; November 13-15, 2002 |
| This is the second symposium in this series the first of which
was held in the Fall of 2000 in Newark, NJ. Polymeric materials
have been an integral part of the electronics industry since its
inception. The earliest applications were for wire insulation and
protective coatings. With the coming of the revolution fostered
by integrated circuits the applications of polymers in
electronics exploded into a variety of areas including:
photoresists, dielectric layers, encapsulants, circuit boards,
multichip modules, underfill materials, thermal compounds and
passivation layers. One of the primary goals of this symposium
will be to provide a forum for discussion of various
ramifications |
of the myriad applications which have arisen in the last 20
years. Particular focus will be on the dissemination of the
latest information available and the cross-pollination of ideas.
The technical program will contain both invited overviews and
contributed original research papers .
The invited speakers have been selected so as to represent
widely differing disciplines and interests, and they hail from
academic, governmental and industrial research laboratories.
This symposium is planned to be a truly international event
both in geographic coverage as well as in spirit. |
Among the topics to be covered are:
- Packaging applications: circuit boards, multichip
modules, binders for ceramic processing and thermal
compounds, dielectrics for thin film wiring
- Chip scale applications: low dielectric insulators, gap
filling, underfill materials, encapsulants for reliability without
hermeticity
- Processing and reliability issues:
- Adhesion
- Fracture/crazing
- Solvent uptake
- Penetrant diffusion
- Corrosion
- Performance characteristics:
- High temperature materials
- Low dielectric materials
- Conducting polymers
- Photo-emitting materials
- Photoresists
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This symposium is being organized under the direction of Dr.
K. L. Mittal, Editor, Journal of Adhesion Science and
Technology by MST Conferences, LLC. A proceedings volume is
planned for this symposium and further details will be provided
in due course. Please notify the conference chairman of your
intentions to present a paper as early as possible. An abstract
of about 200 words should be sent by October 15, 2002 to the
conference chairman by any of the following methods:
E-mail: rhl@mstconf.com
FAX: 212-656-1016
Regular mail:
Dr. Robert H. Lacombe
Conference Chairman
3 Hammer Drive
Hopewell Junction, NY 12533
Contact by phone: 845-226-1393; 845-227-7026
CLICK HERE TO SUBMIT AN ABSTRACT OR GET
ON CONFERENCE MAILING LIST: ONLINE
RESPONSE FORM
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