C A L L F O R P A P E R S
SECOND INTERNATIONAL SYMPOSIUM ON
POLYMERS IN MICROELECTRONICS
Grosvenor Resort Hotel, Orlando, FL; November 13-15, 2002
|This is the second symposium in this series the first of which was held in the Fall of 2000 in Newark, NJ. Polymeric materials have been an integral part of the electronics industry since its inception. The earliest applications were for wire insulation and protective coatings. With the coming of the revolution fostered by integrated circuits the applications of polymers in electronics exploded into a variety of areas including: photoresists, dielectric layers, encapsulants, circuit boards, multichip modules, underfill materials, thermal compounds and passivation layers. One of the primary goals of this symposium will be to provide a forum for discussion of various ramifications||of the myriad applications which have arisen in the last 20
years. Particular focus will be on the dissemination of the
latest information available and the cross-pollination of ideas.
The technical program will contain both invited overviews and
contributed original research papers .
The invited speakers have been selected so as to represent widely differing disciplines and interests, and they hail from academic, governmental and industrial research laboratories. This symposium is planned to be a truly international event both in geographic coverage as well as in spirit.
|Among the topics to be covered are:
|| This symposium is being organized under the direction of Dr.
K. L. Mittal, Editor, Journal of Adhesion Science and
Technology by MST Conferences, LLC. A proceedings volume is
planned for this symposium and further details will be provided
in due course. Please notify the conference chairman of your
intentions to present a paper as early as possible. An abstract
of about 200 words should be sent by October 15, 2002 to the
conference chairman by any of the following methods:
Dr. Robert H. Lacombe
3 Hammer Drive
Hopewell Junction, NY 12533
Contact by phone: 845-226-1393; 845-227-7026
CLICK HERE TO SUBMIT AN ABSTRACT OR GET ON CONFERENCE MAILING LIST: ONLINE RESPONSE FORM