JUNE 19-21, 2000



This is the seventh event in the series of symposia on particles on surfaces. Particles are yield detractors in the manufacturing of sophisticated and sensitive electronic components and are very undesirable in many other technologies. Contamination of optical surfaces and shorting of microelectronic circuits by conducting particles, among other concerns, underscore the importance of particle detection, adhesion and removal. On the other hand, however, in certain instances particle adhesion to surfaces is necessary. The purpose of this symposium is to address the vast ramifications of particles on solid surfaces by bringing together specialists in many allied fields to discuss their latest findings and to identify areas for further investigation.

SESSION I: Monday, June 19, 2000


8:05-8:35: Analysis of Particles on Surfaces; L. Lynn Armentrout; AMD, MS 608, 5204 East Benwhite, Austin, TX 78741

8:35-9:05: Applying Surface Analysis Techniques for Particle Identification; William F. Stickle; Hewlett-Packard Co., 1000 N.E. Circle Blvd., Corvallis, OR 97330-4239

9:05-9:35: Recent Advances in Silicon Wafers' Surface Preparation for IC Manufacturing; Ismail Kashkoush; Akrion, 6330 Hedgewood Dr., #150, Allentown, PA 18106

9:35-10:05: Total Reflection and Grazing Emission X-ray Fluorescence Spectrometry -An Attempt to Measure the Spatial Distribution of Contaminants on Silicon Wafer Surfaces; Heinrich Schwenke and Joachim Knoth; GKSS-Research Center, D - 21494 Geesthacht, Germany

10:05-10:35: Modeling of Scattering from Wafer Contaminants using Two Hybrid Versions of the Discrete-Dipole Approximation; Brent M. Nebeker1, Rodolfo Diaz2, and E. Dan Hirleman1

1) Purdue University, School of Mechanical Engineering, Bldg. 1288, W. Lafayette, IN 47907

2) Arizona State University, Department of Mechanical and Aerospace Engineering, Tempe, AZ 85287-6106

10:35-10:55: Metallic Contamination Control on Polished Oxide Film on Auriga EC Tool; Amar Jha and Periya Gopalan; Speedfam Corporation, 305 North 54th Street, Chandler, AZ 85226

10:55-11:15: Automated Particle Fallout Monitor; Timothy John Mallow1 and Paul A. Mogan2

1) AEG of IDEA, LLC, 3715 Felda Street, Cocoa, FL 32926

2) NASA, M/S MM-G2, KSC, FL 32899

11:15-11:45: Contamination Control Challenges for ULSI Manufacturing; Takeshi Hattori; ULSI R&D Laboratories, SONY Corporation, Core Technology and Network Company, Astugi 243-0014, JAPAN

11:45-1:15: LUNCH BREAK

SESSION II: Monday, June 19, 2000

1:15-1:45: Resuspension of Particles in Turbulent Flows; Goodarz Ahmadi and Haifeng Zhang; Department of Mechanical and Aeronautical Engineering, Clarkson University, Potsdam, NY,13699-5727

1:45-2:15: Development of an In-process Particle Deposition Meter; Heinz Fissan D. Semleit and A. Trampe; Gerhard Mercator University Duisburg, Process- and Aerosol Measurement Technology, Bismarckstr. 81, 47057 Duisburg, GERMANY

2:15-2:45: Particle Deposition Technique for Minimization of Wafer Aging Effects for Cleaning Evaluation; Natraj Narayanswami, Greg Thomes, James Weygand and Jeffery Butterbaugh; FSI International Inc. 322 Hazeltine Drive, Chaska, MN 55318

Seong-Ho Yoo; Particle Technology Laboratory, Department of Mechanical Engineering, 111 Church Street S.E., Minneapolis, MN 55455

Benjamin Y.H. Liu; Particle Technology Laboratory and Environmental Division, Department of Mechanical Engineering, 130-A Mechanical Engineering, 111 Church Street S.E., Minneapolis, MN 55455

2:45-3:15: A New Drying Method for Semiconductor Surfaces; Jose A. Berbel; 906 Kemp Hills Dr., Austin, TX 78737

3:15-3:45: Direct Adhesion Measurements Between Pharmaceutical Materials; F.M. Etzler1, T.H.Ibrahim2, T.R. Burk2, and R.D. Neuman2

1) Boehringer-Ingelheim Pharmaceuticals, 900 Ridgebury, Rd, Ridgefield, CT 06877-0368

2) Department of Chemical Engineering, Auburn University, Auburn, AL 36849-5127

3:45-4:15: Adhesion Measurements to Aid the Formulation of Dry Powder Inhalation; F. Podczeck; Department of Pharmaceutics, The School of Pharmacy, University of London, 29/39 Brunswick Square, London WC1N 1AX, UK

4:15-4:35: Measurements of Adhesion Forces in Pharmaceutical Powder-Polymer Systems by Atomic Force Microscopy; E. Beach1, J. Drelich1 and R. Han2

1) Department of Metallurgical and Materials Engineering, Michigan Technological University, Houghton, MI 49931

2) Dura Pharmaceuticals, 7475 Lusk Boulevard, San Diego, CA 92121

4:35-4:55: Surface Energy Characteristics and Adhesion Measurements under Different Mechanical and Environmental Conditions of Toner Particles; L.H.G.J. Segeren, J.P. Pickering, J.W.A. v/d Berg, and G.J. Vancso; University of Twente, P.O. Box 217, 7500 AE, Enschede, THE NETHERLANDS

4:55-5:15: Particle-Particle Interaction Through Detachment Experiments: Relevance to Surface Contamination; W. Wójcik and B. Jaczuk; Department of Interfacial Phenomena, Faculty of Chemistry, Maria Curie-Sklodowska University, 20-031 Lublin, POLAND

SESSION III: Tuesday, June 20, 2000

8:00-8:30: Adhesion of Small Particles and Methods for Their Removal; Rajiv Kohli; Maxtor Corporation, 2190 Miller Drive, Longmont, CO 80501

8:30-9:00: Effect of Surface Hydrophobicity on Particle Detachment; Mukul M. Sharma; Petroleum Department, CPE2-502 MC/CO300, University of Texas, Austin, TX 78712

9:00-9:30: A New Approach for Particle Removal Based on a Monte Carlo Simulation of Electrostatic Interactions; F. Tardif and I. Constant; LETI (C.E.A.-Technologies avancées) DMEL-CEA/G, 17 rue des Martyrs, 38054 Grenoble Cedex 9, FRANCE

9:30-10:00: Particles at 90 Nm : Can Wet Cleaning Still Do the Job ?; Steven Verhaverbeke; Applied Materials, 3050 Bowers Avenue, MS 0104, Santa Clara, CA 95054

10:00-11:30: Adhesion and Removal of Particles from Charged Surfaces under Humidity Controlled Air Stream; P. Schmitz and J. Cardot; Institut de Mécanique des Fluides, UMR CNRS/INP-UPS 5502, Allée du Professeur Camille Soula, 31400 Toulouse, FRANCE

10:30-11:00: The Effect of Moisture on the Adhesion and Removal of Silica Particles on Silicon Substrates; J. Feng and A. A. Busnaina; Microcontamination Research Laboratory, Clarkson University, Potsdam, NY 13699-5725

11:00-11:30: Contamination Reduction in Loadlocks Through Pressure Control; A. S. Geller, D. J. Rader, and R. C. Dykhuizen; Engineering Sciences Center, Sandia National Laboratories, Albuquerque, NM 87185

11:30-1:00: LUNCH BREAK

SESSION IV: Tuesday, June 20, 2000

1:00-1:30: Ultrasonic Cleaning and Particle Removal; Sami B. Awad; Crest Ultrasonics, Trenton, NJ 08628

1:30-2:00: Advantages of High Power Megasonic Cleaning; Richard Vennerbeck and Mark Beck; ProSys, 1745 Dell Ave., Campbell, CA 95008

2:20-2:30: Influence of Temperature and Dissolved Air on Megasonic Particle Removal; Thomas H. Kuehn, ChingHsu Yang and David B. Kittelson; Department of Mechanical Engineering, University of Minnesota, 111 Church St. S.E., Minneapolis, MN 55455-0111

2:30-3:00: The Surface Topography Challenge is Met by the Single Wafer Megasonic; Mike Olesen and Brian Fraser; VERTEQ, Inc., 1241 E. Dyer Road, Suite 100,

Santa Ana, CA 92705

3:00-3:250: Effect of Megasonics Coupled with SC-1 Process Parameters on Particle Removal on 300mm Silicon Wafers; Stephanie Wicks, Matt Lucey and John Rosato, SCP Global Technologies, 400 Benjamin Lane, Boise, ID 83704

3:20-3:50: Laser Removal of Particles from Solid Surfaces; Yong-Feng Lu; Department of Electrical Engineering, National University of Singapore, 10 Kent Ridge Crescent, Singapore 119260

3:50-4:20: Comparison of Various Wavelengths for Laser Assisted Particle Removal; Susan Allen, K. Imen and N. Campbell; Florida State University, 217 Westcott Bldg., Tallahassee, FL 32306-1330

4:20-4:40: Laser Cleaning of Silicon Membrane Stencil Masks;W. Zapka,1 R. Lilischkis2 and K. F. Zapka3

1) Xaar Jet AB, Box 516, S-17526 Jarfalla, Sweden

2) Fachhochschule Kaiserslautern / Zweibruecken, Amerikastrasse 1, D-66482 Zweibruecken, Germany

3) Universitaet Freiburg, Mikrosystemtechnik, Georg-Koehler Allee 103, D-79085 Freiburg, Germany

4:40-5:00: Laser Cleaning for Particle Removal from Silicon Wafers; M. Mosbacher1,H.-J. Münzer1, V. Dobler1, J. Boneberg1, P. Leiderer1, N. Chaoui2, J. Siegel2, J. Solis2, C.N. Afonso2,T. Fourrier3, G. Schrems3 and D. Bäuerle3

1) Department of Physics, University of Konstanz, Fach M676, 78457 Konstanz, GERMANY

2) Institut für Angewandte Physik, Johannes-Kepler-Universität Linz, 4040 Linz, AUSTRIA

3) Instituto de Optica, CSIC, Serrano 121, 28006 Madrid, SPAIN

SESSION V: Wednesday, June 21, 2000

8:00-8:30: Effect of Surface Roughness on van der Waals and Electrostatic Contributions to Particle Adhesion; John Y. Walz and Ning Sun; Yale University, Department of Chemical, Engineering, New Haven, CT 06520-8286

8:30-9:00: Recent Developments in CO2 Snow Cleaning; Robert Sherman; Applied Surface Technologies, 15 Hawthorne Dr., New Providence, NJ 07974

9:00-9:30: Microcluster Source Operation for Precision Cleaning of Surfaces; Carl Sujo, John F. Mahoney and Julius Perel; Phrasor Scientific, Inc., 1536 Highland Ave., Duarte, CA 91010

9:30-10:00: Removal of Particles from Surfaces Using Surfactants; Michael Free1 and Dinesh Shah2

1) Department of Metallurgical Engineering, University of Utah, Salt Lake city, UT 84112

2) Department of Chemical Engineering, University of Florida, Gainesville, FL 32611

10:00-10:30: The IMEC-Clean: A Clean for Advanced CMOS Manufacturing; Marc Meuris, Sophia Arnauts, Ingrid Cornelissen, K. Kenis, M. Lux, Stefan Degendt, Paul Mertens,I. Teerlinck, R. Vos, L. Loewenstein*,and M.M. Heyns; IMEC, Kapeldreef 75,B-3001 Leuven, BELGIUM

Klaus Wolke; STEAG Microtech, Carl-Benz strasse 10, D-72124 Pliezhauzen, GERMANY

*(Permanent address: Texas Instruments, Kilby Center, Dallas, Texas 75265)

10:30-10:50: The Enhancement of Cleaning Particles by Adding Valtron SP2200 into SC1 Solution; Lewis Liu1 and Steven Verhaverbeke2

1) CFM Technologies Inc., 1336 Enterprise Dr., West Chester, PA 19380

2) Applied Materials, 3050 Bowers Avenue, MS 0104, Santa Clara, CA 95054

10:50-11:10: Determining the Dynamic Efficiency of Cleanroom Wipers for Removal of Liquids and Particles from Surfaces; James Marshall Oathout; E. I. Dupont de Nemours and Co., 1002 Industrial Road, Old Hickory, TN 37138

11:10-11:30: Removal of Fibrin Coated Particles from Surfaces; Sylvie Lorthois and Philippe Schmitz; Institut de Mécanique des Fluides de Toulouse, UMR CNRS/INP-UPS 5502, Allée du Professeur Camille Soula, 31400 Toulouse, FRANCE

11:30-1:00: LUNCH BREAK

SESSION VI: Wednesday, June 21, 2000

1:00-1:30: Spray Cleaning with Hydrofluorocarbon Solutions; Robert Kaiser; Entropic Systems, Inc., Woburn, MA 01801

1:30-2:00: The Removal of Submicron Alumina Particles from Post-CMP Silicon Wafers; N. Moumen, and A. A. Busnaina; Microcontamination Research Laboratory, Clarkson University, Potsdam, NY 13699-5725

2:00-2:30: Particle Removal after Chemical-Mechanical Planarization; Douglas W. Cooper; The Texwipe Co., 650 E. Cresent Ave., Upper Saddle River, NJ 07458

2:30-2:50: Cleaning, Rinsing and Drying Aspects in Post Cu CMP Cleaning; Wim Fyen, Rita Vos, Ivo Teerlinck, Evi Vrancken, Joost Grillaert, Marc Meuris, Paul Mertens and Marc Heyns; IMEC, Kapeldreef 75, B-3001 Leuven, BELGIUM

2:50-3:10: Study of Argon Aerosol Cleaning Method for Post-CMP Cleaning Application; Moon Hee Lee, Kuntack Lee, Yong-Pil Han, and Sang Rok Hah; SAMSUNG Electronics Co., San 24, Nongseo-Lee, Kiheung-Eup, Yongin-City, Kyounggi-Do, Korea

3:10-3:30: Reduction of Cleaning and Verification Times for an Aqueous Based Process by On-line Monitoring; A.J. Pervan1, J. Grilly1, S.L. Lim2, and R. Kaiser1

1. Entropic Systems, Inc., Woburn, MA 01801

2. The Boeing Company, Rocketdyne Propulsion & Power, Canoga Park, CA 91309

3:30-3:50: Removal of Particles Using dHF-based Cleaning Recipes; R. Vos, I. Cornelissen, X. Kaidong, M. Lux, W. Fyen, M. Meuris, P.

Mertens and M. Heyns; IMEC, Kapeldreef 75, B-3001 Leuven, BELGIUM

Klaus Wolke; STEAG Microtech, Carl-Benz strasse 10, D-72124 Pliezhauzen, GERMANY

3:50-4:10: Particle Removal from Semiconductor Substrates Using the Plasmax Technology; J. B. Bailey and John J. Festa; Beta Squared, Inc., 601 Millennium Dr., Allen, TX 75013

A.S. Geller; Engineering Sciences Center, Sandia National Laboratories, Albuquerque, NM 87185