FINAL PROGRAM

INTERNATIONAL SYMPOSIUM ON POLYMERS IN MICROELECTRONICS

OCTOBER 11-13, 2000

ROBERT TREAT HOTEL

NEWARK, NJ

Polymeric materials have been an integral part of the electronics industry since its inception. The earliest applications were for wire insulation and protective coatings. With the coming of the revolution fostered by integrated circuits the applications of polymers in electronics exploded into a variety of areas including: photoresists, dielectric layers, encapsulants, circuit boards, multichip modules, underfill materials, thermal compounds and passivation layers. One of the primary goals of this symposium is to provide a forum for discussion of various ramifications of the myriad applications which have arisen in the last 20 years. Additionally, this symposium is organized to serve as a venue for the mutual and fruitful interaction among participants for the furthering of scientific, professional and practical interests.



SESSION I Wednesday, Morning October 11, 2000



8:30 - 8:35: OPENING REMARKS



8:35 - 9:05: Beyond DUV: The Role of Photoresists in The Next Lithography Generations; Ralph R. Dammel; AZ Electronic Materials, Clariant Corporation, Somerville, NJ 08876



9:05 - 9:35: E-Beam Resists for Advanced Mask and Device Making; Marie Angelopoulos; IBM T.J. Watson Research Center, P.O. Box 218, Room 19-203, Yorktown Heights, NY 10598



9:35 - 10:05: Layer-Specific Resists for 193nm Lithography; M. Dalil Rahman, Munirathna Padmanaban, Jun-Bom Bae, Woo-Kyu Kim, Takanori Kudo, Douglas McKenzie and Ralph R. Dammel; AZ Electronic Materials, Clariant Corporation, Somerville, NJ 08876



10:05 - 10:30: COFFEE BREAK



10:30 - 11:00: Hybrid Materials for Optoelectronics Manufacturing; Terho Kololuoma, Ari Kärkkäinen and Juha T. Rantala; VTT Electronics

Kaitoväylä 1, 90570 Oulu, Finland









11:00 - 11:30: Utilizing Polymeric Metal Chelates and Their Self-Assemblies for LED Applications; Fotios Papadimitrakopoulos; Department of Chemistry, Polymer Science Program, Nanomaterials Optoelectronics Laboratory, Institute of Materials Science, University of Connecticut, Storrs, CT 06269-3136



11:30 - 12:00: Novel Organic and Polymeric Materials for Photonic Applications; Zhonghua Peng; Department of Chemistry, University of Missouri-Kansas City, Kansas City, MO 64110



12:00 - 1:30: LUNCH



SESSION II Wednesday Afternoon, October 11, 2000



1:30 - 2:00: New Results about Cyanate Resins for Microelectronics; Monica Bauer; Fraunhofer Institute of Applied Materials Research, Kantstrasse 55, D-14513 Teltow, GERMANY



2:00 - 2:30: Corrosion Inhibition of Al Metal in Microelectronic Devices Assembled in Plastic Packages; Antonino Scandurra1, Giuseppe Currò2, Ferruccio Frisina2 and Salvatore Pignataro3; 1) Laboratorio Superfici ed Interfasi - Consorzio Catania Ricerche, c/o ST Microelectronics, Stradale Primosole 50, 95100 Catania, ITALY; 2) STMicroelectronics, Stradale Primosole 50, 95100 Catania, ITALY.; 3) Dipartimento di Scienze Chimiche Università di Catania, Viale A. Doria 6, 95125 Catania, ITALY.



2:30 - 3:00: COTS Approach to Military T/R Module Fabrication; A. Sun1, P. Bronecke1, W. Kritzler1, C. Moyer1, G. Yan1 ,C. Blair2, G. Riddle2, and S. Kaplan3; 1) Lockheed Martin - GES, Moorestown, NJ; 2) Bryte Technologies, Morgan Hill, CA; 3) 4th State Inc., Belmont, CA



3:00 - 3:30: COFFEE BREAK



3:30 -4:00: Molding Compound Additives Causing Adhesion Failure at Chip Interface in Electronic Devices; Antonino Scandurra1, Roberto Zafarana2, Yuichi Tenya3, and Salvatore Pignataro4; 1) Laboratorio Superfici ed Interfasi - Consorzio Catania Ricerche, c/o ST Microelectronics, Stradale Primosole 50, 95100 Catania ITALY; 2) STMicroelectronics, Stradale Primosole 50, 95100 Catania, ITALY; 3) Toshiba Chemical Corporation, Hankyu Express Building, 3-9, 3-chome, Shimbashi, Minato-ku, Tokyo 105-0004, JAPAN; 4) Dipartimento di Scienze Chimiche Università di Catania, Viale A. Doria 6, 95125 Catania, ITALY



4:00 - 4:30: Optical Crack Tracing, A New Method to Automatically Measure Fracture Toughness and a Great Step Forward in Ensuring High Accuracy, Efficiency and Independence of the Operator; C. Uhlig1, O. Kahle1, J. Keller, B. Wieneke2, M. Bauer1; 1) Fraunhofer Institute for Reliability and Microintegration, Branch Lab Polymeric Materials and Composites, D-14513 Teltow, GERMANY; 2) LaVision GmbH, D-37079 Göttingen, GERMANY



SESSION III Thursday Morning, October 12, 2000





8:30 - 9:00: Low Dielectric Constant Polymers in Optoelectronic Applications; Carlye Case; Lucent Technologies, Murray Hill, NJ 07974



9:00 - 9:30: Fluoro-Polyimides and CoPolyimides: Synthesis and Thermal Degradation Kinetics Studies; Rohit H. Vora 1, 2, P. Santhana Gopala Krishnan1, S. Veeramani1, Suat Hong Goh2 and Tai-Shung Chung 1, 3; 1) Institute of Materials Research and Engineering (IMRE),3, Research Link, Republic of SINGAPORE 117602; 2) Department of Chemistry, National University of Singapore, 10 Kent Ridge Crescent, Republic of SINGAPORE 119260; 3) Department of Chemical and Environmental Engineering, 10 Kent Ridge Crescent, Republic of SINGAPORE 119260



9:30 - 10:00: Thermal Imidization of Poly(amic acid) Precursors on Modified Si(100) Surface From UV-Induced Graft Polymerization and Plasma Polymerization of Glycidyl Methacrylate; Yan Zhang1, K. L. Tan1 and E. T. Kang2;

1) Dept. of Physics, National University of Singapore, Kent Ridge, SINGAPORE 119260; 2) Dept. of Chemical Engineering, National University of Singapore, Kent Ridge, SINGAPORE 119260



10:00 - 10:30: COFFEE BREAK



10:30 - 11:00: SiLK Etching on the Lam Research Corporation 4520XLE; C. Janowiak1, S. Ellingboe2 and I. Morey; 1) Lam Research Corporation, 4400 Cushing Parkway, Fremont, CA 94538-6401; 2) Lam Research Ireland, Collinstown Industrial Park, Leixlip County Kidare, IRELAND; 3) Lam Research Singapore, 21 Serangoon North Ave. 5,#05-02 Ban, SINGAPORE



11:00 - 11:30: Diffusion and Interface Formation During Noble Metal Deposition onto Fully Cured Low-k Polymers; F. Faupel, A. Thran, M. Kiene, T. Strunskus, V. Zaporojtchenko, and K. Behnke; Lehrstuhl für Materialverbunde, Technische Fakultät der Universität Kiel, Kaiserstr. 2, 24143 Kiel, GERMANY



11:30 - 12:00: Surface Modification of Poly(tetrafluoroethylene) Films by UV-Induced Graft Copolymerization and Plasma Polymerization for Adhesion Enhancement with Electrolessly Deposited Copper; G. H. Yang, E. T. Kang, and K. G. Neoh; Dept. of Chemical Engineering, National University of Singapore, Kent Ridge, SINGAPORE 119260



SESSION IV Thursday Afternoon, October 12, 2000





1:30 - 2:00: Approaching Adhesion and Process Issues for Microelectronics Packaging Concerns Using Molecular Modeling; N. E. Iwamoto; Honeywell Electronic Materials, 10080 Willow Creek Road, San Diego, CA 92131



2:00 - 2:30: Observations of Reliability Changes of an Epoxy Encapsulated Power Supply Under Aggressive Environmental Conditions; Elizabeth Walker; Senior Product Supervisor, Emerson & Cuming, 46 Manning Road, Billerica, MA 01821



2:30 - 3:00: Fluorinated Coatings Formation by Spontaneous Polymerization; Haipeng Zheng and James P. Bell; Polymer Program, Institute of Materials Science, U-136, University of Connecticut, Storrs, CT 06269-3136





3:00 - 3:30: Strengthening Underfill/Passivation Interfaces for Flip-Chip Assemblies; R.A. Pearson, B. J. McAdams, R. O. Oldak and D. J. Welsh; Microelectronics Packaging Materials Lab - Lehigh University, 5 East Packer Ave., Bethlehem, PA 18015