CALL FOR PAPERS



FOURTH INTERNATIONAL SYMPOSIUM ON

SILANES

AND OTHER COUPLING AGENTS

To be held June 11-13, 2003

NOVOTEL, Toronto Centre, Toronto, CANADA

This symposium continues the tradition set by the first symposium in this series:"Silanes and Other Coupling Agents" which was hosted in 1991 by the Dow Corning Corporation in honor of Dr. Edwin P. Plueddemann. As with its predecessor, this symposium will be concerned with the technological areas where the use of surface primers such as silanes is critical to the success of coating technology. The use of silanes as coupling agents for polyimide coatings and in glass fiber composites are just two applications where the use of silanes has been an enabling factor in the success of particular manufactured products. Quite surprisingly, silanes have also found a role in biotechnology as specific coupling agents for bonding polynucleotides to the so-called "gene chips". This symposium is organized to bring together scientists, technologists and engineers interested in all aspects of coupling agent technology, to review and assess the current state of knowledge, to provide a forum for exchange and cross-fertilization of ideas and to define problem areas which need intensified efforts.

The invited speakers have been selected so as to represent widely differing disciplines and interests, and they hail from academic, governmental and industrial research laboratories. This meeting is planned to be a truly international event both in geographic coverage as well as in spirit. The technical program will contain both invited overviews and contributed original research papers.

AMONG TOPICS TO BE COVERED ARE:



  • Mechanisms of silanes action.
  • Role of silanes in adhesion of coatings and composites.
  • Deposition techniques:

- solution
- plasma
- vapor

  • Non-silane adhesion promoters.
  • Plasma polymerized coatings as adhesion promoters.
  • Relevance of silanes in durability of bonds.
  • Applications:

- coatings
- adhesive joints
- composites

  • Surface/interface characterization.

- novel analytical techniques

- advanced instrumentation

This symposium is being organized by MST Conferences, LLC under the direction of Dr. K. L. Mittal, Editor, Journal of Adhesion Science and Technology. A special issue of JAST is planned for this symposium and further details will be provided in due course. Please notify the conference chairman of your intentions to present a paper as early as possible. An abstract of about 200 words should be sent by January 30, 2003 to the conference chairman by any of the following methods:

E-mail: rhl@mstconf.com

FAX: 212-656-1016

Regular mail:

Dr. Robert H. Lacombe

Conference Chairman

3 Hammer Drive

Hopewell Junction, NY 12533

Contact by phone: 845-226-1393; 845-227-7026

Or click the online response form below to submit an abstract or register



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