FINAL PROGRAM



THIRD INTERNATIONAL SYMPOSIUM ON

ADHESION ASPECTS OF POLYMERIC COATINGS

Providence Biltmore Hotel, Providence, Rhode Island (USA)

May 23-24, 2002

This symposium continues the series of meetings on this subject the first of which was held under the auspices of the Electrochemical Society in Minneapolis, MN, in 1981. The second was held in Newark NJ in 2000. The plan is to cover the progress and breakthroughs which have occurred in the interim. Polymeric coatings are used for a number of purposes, e.g., decorative, protective, functional (as dielectrics or insulators). Additionally, a special application of polymeric (organic) coatings is their use as lithographic materials for making integrated circuit elements.

Irrespective of the purpose of the coating it must adhere well to the underlying substrate. The primary purpose of this Symposium is to bring out the various material/process parameters which influence the adhesion of polymeric coatings with a primary thrust on polymeric coatings which are organic in nature.



SESSION I: THURSDAY, May 23, 2002



2:00-2:05pm: INTRODUCTORY REMARKS



2:05-2:40: David Packham; Materials Research Centre, E.A.S., University of Bath, Bath BA2 7AY, Somerset, U.K.; Influence of Coating and Substrate Properties on the Adhesion of Polymeric Coatings



2:40-3:10: Matthew R. Libera1, S. McKnight,2 and D. Arayasantiparb3; 1) Dept. of Chemical, Biochemical and Materials Engineering, Stevens Institute of Technology, Hoboken, NJ 07030; 2) Army Research Laboratory, Aberdeen, MD; 3) presently with the Mahidol University, Bangkok, THAILAND; The Width of The Epoxy-Alumina Interphase



3:10-3:40: Guido Hora; Fraunhofer Wilhelm-klauditz-institute fur Holtzforschung (WKI), Bienroder Weg 54E, 38108 Braunschweig, GERMANY; Improving Wet Adhesion of Waterborne Acrylic Dispersion on Wood by Bond Activation



3:40-4:10: Chhiu-Tsu Lin; Department of Chemistry and Biochemistry, Northern Illinois University, DeKalb, IL 60115; Surface Adhesion in In-Situ Phosphatizing Coatings



4:10-4:40: Kunal Shah; Department of Materials Science and Engineering, University of Cincinnati, Cincinnati, OH 45221-0012; Evaluation of Adhesion Property of Conducting Polymer Composite Coatings on Al-2024











SESSION II: Friday May 24, 2002



8:30-9:00: Mark R. VanLandingham; National Institute of Standards and Technology (NIST), 100 Bureau Dr., Stop 8621, Gaithersburg, MD 20899-8621; Characterizing Polymer Viscoelasticity Using Nanoindentation



9:00-9:30: N. X. Randall; CSM Instruments S. A., Jaquet-Droz 1, CH-2007 Neuchâtel, SWITZERLAND; Nanoscale Scratching of Polymers



9:30-10:00: Flavio Deflorian, S. Rossi, L. Fedrizzi and P.L. Bonora; Dipartimento di Ingegneria dei Materiali, Università di Trento, Via Mesiano 77, 38050 Trento, ITALY; The Role of Ions Diffusion in the Cathodic Delamination Rate of Organic Coated Steel



10:00-10:30: COFFEE BREAK



10:30-11:00: Hans-Juergen P.Adler; Dresden University of Technology, Institute of Macromolecular Chemistry and Textile Chemistry, D- 01062 Dresden, GERMANY; Ultrathin Organic Layers as Adhesion Promoters and Corrosion Inhibitors



11:00-11:30: Yves Holl; University Louis Pasteur and Institute Charles Sadron (CNRS); 6, rue Boussingault, 67083 Strasbourg, FRANCE; Distribution of Small Molecules in Waterborne Coatings



11:30-12:00: Aydin Aykanat and Jude O. Iroh; Materials Science and Engineering, University of Cincinnati, Cincinnati, Ohio, 45221-0012; Carbon Fiber-Polyaniline Composites: Kinetics of Electrodeposition of Polyaniline onto Carbon Fibers by Cyclic Voltammetry



12:00-12:30: Joerg Rottler and Mark. O. Robbins; Department of Physics and Astronomy, The Johns Hopkins University, 3400 N. Charles Street, Baltimore, MD 21218; Failure of Bulk and Thin Film Glassy Polymer Adhesives



12:30-1:00: H. van der Werff; Corus Research, Development & Technology, IJmuiden Technology Center, THE NETHERLANDS; Peelable Seals with Polymer Coated Packaging Steels