CALL FOR PAPERS



INTERNATIONAL SYMPOSIUM ON POLYMERS IN MICROELECTRONICS

To be held October 11-13, 2000 at the Robert Treat Hotel; Newark, NJ


Polymeric materials have been an integral part of the electronics industry since its inception. The earliest applications were for wire insulation and protective coatings. With the coming of the revolution fostered by integrated circuits the applications of polymers in electronics exploded into a variety of areas including: photoresists, dielectric layers, encapsulants, circuit boards, multichip modules, underfill materials, thermal compounds and passivation layers. One of the primary goals of this symposium will be to provide a forum for discussion of various ramifications of the myriad applications which have arisen in the last 20 years. Particular focus will be on the dissemination of the latest information available and the cross-pollination of ideas. The technical program will contain both invited overviews and contributed original research papers, and it is planned to chronicle the proceedings properly in a hard-bound volume
The invited speakers have been selected so as to represent widely differing disciplines and interests, and they hail from academic, governmental and industrial research laboratories. This symposium is planned to be a truly international event both in geographic coverage as well as in spirit.

Among the topics to be covered are:

  1. Processing and reliability issues:
    1. Adhesion
    2. Fracture/crazing
    3. Solvent uptake
    4. Penetrant diffusion
    5. Corrosion


  1. Performance characteristics:
    1. High temperature materials
    2. Low dielectric materials
    3. Conducting polymers
    4. Photo-emitting materials
    5. Photoresists

This symposium is being organized by MST Conferences, LLC under the direction of Dr. K. L. Mittal, Editor, Journal of Adhesion Science and Technology. A proceedings volume is planned for this symposium and further details will be provided in due course. Please notify the conference chairman of your intentions to present a paper as early as possible. An abstract of about 200 words should be sent by September 15, 2000 to the conference chairman by any of the following methods:

E-mail: rhl@mstconf.com
Contact by phone: 914-226-1393
FAX: 212-656-1016

Regular mail:

Dr. Robert H. Lacombe
Conference Chairman
3 Hammer Drive
Hopewell Junction, NY 12533


CLICK HERE TO SUBMIT AN ABSTRACT OR GET ON CONFERENCE MAILING LIST: ONLINE RESPONSE FORM
MENU HOME

MST Conferences Webmaster
Your comments and inquiries are most welcome
Address all correspondence to:
rhlacombe@compuserve.com

Copyright © 1999, MST Conferences, LLC
Revised -- 1/6/2000
URL: http://mstconf.com/polymicro-cfp.htm